PAC Global

Workshop: Sanmina Tech Day

PAC Mexico hosted a Technology event that aims to maximize the use of the FUJI Platform Options, Tools and Capabilities This Practical workshop was attended by Sanmina and Fuji, a full day session reviewing practical cases and adapting them to the functions / tools of the FUJI platform All this in benefit of an improvement in the performance of the production line, reduce times of activities/tasks and increase the utilization of the production line We are pleased to know that the event was a success in attendance and contents. PAC Mexico hopes to make this and the following events, the Standard in Support, Training and Attention for the Industry.
SmartFAB

The SmartFAB modularizes the parts supply, work transport, and assembly head units required for various types of assembly. Just connect the units you require to the base machine to create optimal production line for your needs.
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Fuji NXT III

The NEW NXT III is a highly productive, multi-funcional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per hour. The NXT III supports the smallest parts being used in mass production with extreme placcing accuracy.
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Viscom S3088 CCI – AOI

Reliable conformal coating inspection - powerful and precise
Precise detection of defect sites

Robust short-cycle inspections

Easily adaptable to various conformal coatings

Fast inspection program creation

Dependable DMC and OCR reading

Angled views for reliable inspection of/on component leads

Wet inspection enables a check before conformal coating cures

Highly precise inspection of plasma and nanocoatings with HighDensity camera module

Layer thickness inspection (3D Spot Measurement)

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Viscom X8068 – 3D MXI

Flexible X-ray inspection for SMT/electronics

Manual, semiautomatic or fully automatic X-ray inspection

Modular, low-maintenance all-metal tube

Flexible sample sizes up to 722 mm Ø

Variable angled radiation, simple and quick manageability

Superb image quality through flat panel detectors

Inspection object visualized by camera image

High resolution

All 5 axes CNC axes

Viscom Quality Uplink: simplified classification, effective process control
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Viscom X7056-II – 3D AXI/3D AOI

3D X-ray inspection – Extremely fast and flexible

Revolutionary handling concept xFastFlow for printed circuit boards change in as little as 4 seconds

Ultra thorough inspection of single or double-sided electronic assemblies

System can be used as a 3D AXI system or 3D AXI/3D AOI combination

Three different flat panel detector sizes for scalable throughput

Versatile and adaptable inspection depth

Viscom Quality Uplink: Effective networking and process optimization

Comprehensive IPC-compliant AXI inspection library

High-quality 3D AXI volume calculation with planar CT

Highest in-line AXI resolution for the best defect coverage and detection
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Aquastorm 60 In-line Cleaner

The Electrovert® Aquastorm™ series precision cleaning systems are designed to provide complete cleaning process flexibility, superior cleaning and drying performance, process monitoring, and reliability. The Electrovert approach is to provide the market with a range of Aquastorm series cleaners that utilize technologies that exceed cleaning and drying expectations.
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Electra Wave

The Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process flexibility and delivers world-class soldering results.
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Momentum Elite Printer

The MPM® Momentum® Elite is the top-performer of the Momentum series, boasting the highest throughput and shortest cycle times of all. Its vision system is driven by servos for speed, and it’s configured with a highly-efficient triple track rail system featuring an input buffer, a central processing section, and an output buffer.
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